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X-ray electronics inspection systems respond to a growing demand for flexible, detailed and affordable inspection to cope with the demands of ever-smaller electrical components and comply with tighter

XT V 130/ XT V 160XT V 130/ XT V 160

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  • XT V 130 Electronics X-ray Inspection
  • XT V 160 Electronics X-ray Inspection

X-ray and CT Inspection for industrial and electronic applications
Nikon Metrology manufactures X-ray and Computed Tomography (CT) inspection systems that get the inside picture of complex industrial parts, by looking into the internal structure. The CT capability is used to qualify and quantify any inner or outer dimension in a smooth, non-destructive process. X-ray electronics inspection systems respond to a growing demand for flexible, detailed and affordable inspection to cope with the demands of ever-smaller electrical components and comply with tighter quality standards.

1. XT V 130 Electronics X-ray Inspection

  • Compact, versatile and easy-to-use electronics QA system
  • With the advent of many newer type of electronic components, surface inspection is no longer an option. As most electrical connections remain hidden for the eye, the ability to run premium quality real-time X-ray is more important than ever before. Designed for 100% (μ)BGA, multi-layer and PCB solder joint inspection, the XT V 130 X-ray system is a high-precision, flexible solution that facilitates defect analysis in loaded PCB boards. The system's Inspect-X software offers automated inspection functions and (optional) automatic board identification, which ensure high inspection throughput rates.

 

Up to 320x image magnification enables users to zoom in on any specific item of interest

Features
  • Proprietary micro-focus source with 3 micron focal spot size
  • High, 16-bit resolution imaging and image processing tools
  • Large tray for loading multiple boards
  • Optional rotation table (360° continuous)
Applications
  • Electronic and electrical components
    - Broken wedge bonds, lifted ball bonds, wire sweep, die attach, dry joints, bridging/shorts, voiding, BGA, etc.
  • Populated and unpopulated PCBs 
    - View surface mount defects i.e. misaligned devices, solder joint porosity and bridging
    - Detailed inspection of vias, through-hole plating and multi-layer alignment
    - Wafer-level chip scale packages (WLCSP)
    - BGA and CSP inspection
    - Non-lead solder inspection
  • Micro-electro-mechanical systems (MEMS, MOEMS)
  • Cables, harnesses, plastics and many more
Benefits
  • X-ray inspection workhorse for electronics quality assurance
  • Macro-based automation requires no programming skills
  • Component-specific automated pass/fail analysis, off-line visualization station and automatic report generation
  • Ready to automate complex tasks with VBA
  • On-line operation with intuitive joystick navigation
  • Low-cost maintenance with open-tube technology
  • Safe system requiring no special precautions or batches
  • Small footprint and low-weight for easy installation

 

Related solutions
  • XT V 160
  • Inspect-X

2. XT V 160 Electronics X-ray Inspection

  • Top-class inspection system for miniaturized electronic components
  • Component connections on today’s compact and densely populated PCBs are hidden by other components, making X-ray the only viable inspection solution. XT V 160 is an easy-to-use, cost-effective and high-quality PCB inspection system targeting production facilities and failure analysis laboratories.
  • In automated inspection mode, samples can be inspected at the highest throughput. In manual mode, intuitive software and high-precision sample manipulation enable operators to visualize and evaluate the tiniest internal defects and deficiencies.
Features
  • NanoTechTM source with submicron focal spot size
  • Fast data capture and high-quality imaging
  • Large tray for loading multiple boards
  • Customizable macros automate measurement workflow
  • Remote validation station available
Applications
  • Solder reflow analysis
  • BGA connectivity and analysis
  • Solder void calculation
  • Through hole measurement and inspection
  • Die attach voiding measurement
  • Ball bond analysis
  • Stitch bond analysis
  • Micro BGA / chip on chop analysis
  • Pad array analysis
  • Dry joint detection and analysis
Benefits
  • Flexibility combined in one system 
    - Interactive visualization
    - Fully automatic X-ray inspection
    - Optional CT for in-depth analysis
  • Fast operation with intuitive GUI and interactive joystick navigation
  • Low-cost maintenance with open-tube technology
  • Safe system requiring no special precautions or badges
  • Small footprint
Related solutions
  • XT V 130
  • Inspect-X

 

XT V 130 Specification

XT V 160 Specification


N.I.VINA Co., Ltd.
Địa chỉ: số 4-BT3 khu nhà ở Trung Văn, phường Trung Văn, quận Nam Từ Liêm, Hà Nội
Tel: (+84)-24-3212-3727 - Fax: (+84)-24-3212-3728
Email: info@nivina.com.vn  - Web: www.nivina.com.vn