MÁY ĐO 3D NIKON VMZ-K SERIES,Máy đo tọa độ tự động 3D đa chức năng NIKON VMZ-K Series

SPECIFICATION :

Objective lens
Magnification		3x	7.5x	15x	30x
W.D.		24mm	5mm	20mm	5mm
Confocal optics (area height measure)
Field of view		4 x 3mm	1.6 x 1.2mm	0.8 x 0.6mm	0.4 x 0.3mm
Height measurement repeatability (2σ)		0.35µm	0.25µm	0.25µm	0.20µm
Height measurement resolution		0.01µm
Brightfield optics (2D measurement)
Zooming method		Motorized 5-step zoom
Field of view		4 x 3mm to 0.27 x 0.2mm	1.6 x 1.2mm to 0.11 x 0.08mm	1.26 x 0.95mm to 0.1 x 0.074mm	0.63 x 0.47mm to 0.05 x 0.04mm
Illumination		White LED diascopic and episcopic illuminator for all types, White LED ring light for type 3x and 7.5x
Auto focus		Vision AF and TTL laser AF (Scan Mode available)
Main body
Stroke (X, Y, Z)		300 x 400 x 150mm
Guaranteed loading capacity		30kg
Maximum permissible error	MPE_E1X	1.5 + 2.5L/1000µm
Maximum permissible error	MPE_E1Y	2.5 + 2.5L/1000µm
Maximum permissible error of Z axis	MPE_E1Z	1 + L/1000µm
Main unit weight		830kg
Power source/power consumption		AC 100 to 240 V ± 10% 50/60 Hz / 13A to 6.5A
Operating condition		Temperature: 20°C ± 0.5K, Humidity: 70% or less
Acquired standard		CE marking (low voltage/EMC/laser)
Footprint		2500 x 1900mm

The Confocal NEXIV, a ground-breaking Multi-Functional video measuring system, was developed on the strength of Nikon's leading opto-mechatronics technologies.

It incorporates confocal technology, brightfield with a 15X zoom, and TTL Laser AF. No matter what geometrical measurements you need–two-dimensional or three-dimensional–inspection and evaluation is exceptionally fast and accurate with this system!

The Confocal NEXIV can be optimally used for measurements of a variety of bump heights on advanced IC packages such as wafer-level CSP, as well as for the inspection of highly complicated structures of MEMS and probe card.

Features

Simultaneous wide-area height measurements with Nikon proprietary confocal optics
2D measurement with 15x brightfield zoom optics
Fully compatible with 300mm wafer measurement at semiconductor fabs

Applications

IC Packages
- Flip Chip/COF(Bump)/COG
- CSP (FBGA)/SIP (Bump, Wire)
- Interposer (Pad height)
MEMS
Probe Card (Silicon Probe, Au Probe)
Precise Glass Components (Micro Lens, Contact Lens)
Photo Spacer Width/Height for Color Filter for FPD Panel